(footprint "CONDENSER MIC"
	(version 20241229)
	(generator "pcbnew")
	(generator_version "9.0")
	(layer "F.Cu")
	(property "Reference" "REF**"
		(at -0.63521 -5.71696 0)
		(layer "F.SilkS")
		(hide yes)
	)
	(property "Value" "CONDENSER MIC"
		(at 0 8 0)
		(layer "F.Fab")
	)
	(property "Datasheet" ""
		(at 0 0 0)
		(layer "F.Fab")
		(hide yes)
	)
	(property "Description" ""
		(at 0 0 0)
		(layer "F.Fab")
		(hide yes)
	)
	(attr through_hole)
	(pad "GND" thru_hole circle
		(at -2 1.25)
		(size 1.278 1.278)
		(drill 0.77)
		(layers "*.Cu" "*.Mask")
		(remove_unused_layers no)
		(solder_mask_margin 0.102)
	)
	(pad "OUT" thru_hole circle
		(at -2 -1.25)
		(size 1.278 1.278)
		(drill 0.77)
		(layers "*.Cu" "*.Mask")
		(remove_unused_layers no)
		(solder_mask_margin 0.102)
	)
	(embedded_fonts no)
)
